Flip Chip Die Bonder We would like to take this opportunity to introduce Datacon Flip Chip Die Bonder, the leader from the very beginning. We offer you the ideal system for series production in this highly sophisticated technology. Our products are at very competitive prices.
You will be pleased to know that through continuous product improvements and innovative research and development work, we have achieved a reputation as an international technological leader. Multiple international awards underline this claim.
Datacon has the reputation to consistently create innovative, dynamic, customer and market-specific strategies which lead to trendsetting product developments in the back-end assembly field of the Advanced Packaging Market. We have a global presence with subsidiaries handling marketing, sales and technical support in their respective regions. Online Die Attach Dispensing by die-attach-dispensing.com |
